IPC JEDEC J-STD-033B.1 PDF

Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

Author: Disho Nitilar
Country: Saint Lucia
Language: English (Spanish)
Genre: Business
Published (Last): 18 June 2010
Pages: 94
PDF File Size: 20.93 Mb
ePub File Size: 20.5 Mb
ISBN: 620-2-76626-882-4
Downloads: 93799
Price: Free* [*Free Regsitration Required]
Uploader: Gardabar

An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture weight gain to an acceptable level. I recommend changes to the following: Level 2 parts are still adequately dry. It can occur due to misprocessing e. Amol Kirtikar, Sud-Chemie Inc. Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life see Clause 5.

If the actual shelf life pic exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5. Individuals or companies are invited to submit comments to IPC.

Table may be used as a guide in identifying an appropriate bake cycle. The heat absorbed by the package body j-sstd-033b.1 such operations is typically much lower than for bulk surface mount re? Spots without printing shall be tested. Drying per an allowable option resets the?

Standards & Documents Search

Such processes are not allowed for many SMDs and are not covered by the component quali? Therefore, the effect of these materials must be compensated for by baking or, if required, adding additional desiccant in the MBB to ensure the shelf life of the SMD packages. The bags should be inspected to verify there are no holes, gouges, tears, punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag.

  BARRY JOHNSON ALGORITHMIC TRADING DMA 2010 PDF

These methods are provided to avoid damage from moisture absorption and exposure to solder re? Peak package body temperature: Devices require bake, before mounting, if: For the purpose of this standard, the bar code label is on the lowest level shipping container and includes information that describes the product e.

With component and board temperature restrictions in mind, choose a bake temperature from Table ; then determine the appropriate bake duration based on the component to be removed.

While the principal members of the Joint Moisture Classi? Testing Procedure Place the sealed container of cards into the chamber. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications j-std-03b.1 their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or jefec.

A dry cabinet should not be considered a MBB. Calculated shelf life in sealed bag: A safe, yet conservative, handling approach is to expose the SMD packages only up to the maximum time limits for each moisture sensitivity level as shown in Table Water clean processes after the? Although the body temperature during re? If bake is interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time.

C If blank, see adjacent bar code label 3. Level 1 parts classi? If any component on the board has exceeded its? The HIC is packed inside the moisture-barrier bag, along with j-dtd-033b.1 desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices have been subjected.

  ALTNEULAND HERZL PDF

The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts. Maurice Brodeur, Analog Devices Inc. Refer to Clause 6. Users may reduce the actual bake time if technically justi?

An example HIC is shown in Figure Marty Rodriguez, Jabil Circuit, Inc. A representative dry-pack con?

J-STDC操作.包装.出货及湿敏表面安装设备的使用_百度文库

If the bags jedce opened under factory ambient conditions, see Clause 4. Set the chamber to the? When dry packing, the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB. Nominally, an acrylic box with a volume of approximately 2 cubic feet, having facilities for access to the box interior while maintaining atmosphere is used. This document describes the standardized levels of? Requirement, paragraph number Test Method numberparagraph number The referenced paragraph number has proven to be: The caution label shall be affixed to the outside surface of the MBB.

Storage in a dry cabinet may be considered equivalent to storage in a dry pack with j-tsd-033b.1 shelf life. If the distributor practice is to repack the MBBs with active desiccant, then this time does not need j-std-033n.1 be subtracted from the MET.